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  • Capillary | Orbray Co. , Ltd.
    Capillaries are tools used in wire bonding machines to connect IC chip electrodes and lead terminals with wires Our company designs capillaries according to bonding specifications, and manufactures them using high quality materials
  • Capillary Wire Bonding - katings. com
    Capillary Wire Bonding A typical step by step overview of the wire bonding process showing the formation of the free air ball, ball bond, stitch bond, and concluding with the reformation of the next free air ball
  • Wirebonding Tools: Capillaries, Wedges, etc. - eesemi. com
    Capillaries hold and control the bonding wire as well as form bonds from it during the ball bonding process Capillaries are ceramic axial-symmetric tools with vertical feedholes (holes where the bonding wires are fed) through its center
  • 89017 Capillary KH Lim Brochure - Dou Yee Enterprises
    Dou Yee has developed the HMX Capillary with the objective to improve the bondability of the stitch bond through better coupling between the capillary and the wire during bonding Its HMX proprietary process, not
  • Analysis of wire bonding capillary and capillary ageing phenomenon
    Wire bonding is the mainstream method of internal connection in packaging, and its principle is: using heat, pressure and ultrasonic energy to bind the bond lead to the metal pad Bonding (atomic bonding) is used to achieve signal transmission between chips and between chips and packages
  • Wire bond cleaning method and wire bonding recovery process
    The method includes configuring a wire bonding machine to perform customized movements with a capillary tool of the wire bonding machine, etching bulk contaminants over one or more
  • Capillaries - Semiconductor Materials and Equipment
    Wire bonding capillaries are specialized tools used in the wire bonding process to make electrical connections between two points in an electronic device Capillaries are small cylindrical metal tubes with a fine bore, typically made of materials such as tungsten, ruby, or ceramic
  • Basic Wire Bonding Theory Parameter Development Practical Applications
    Standard PCB material, used for Chip on Board Handles some heat and ultrasonics but drawback is often its large dimensions The bonding process is the following sources of energy combined to cause the material from the wire or ribbon to join to the target material in an intermetallic joint


















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